Pixel circuit

ABSTRACT

Provided is a display device including a plurality of pixels at least one of which has a first transistor and a light-emitting element. The first transistor includes a gate electrode, a gate insulating film over the gate electrode, an oxide semiconductor film over the gate insulating film, and a first terminal and a second terminal electrically connected to the semiconductor film. The second terminal is electrically connected to the light-emitting element. A region in which the first terminal overlaps with the gate electrode can be smaller than a region in which the second terminal overlaps with the gate electrode.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is based on and claims the benefit of priority from theprior Japanese Patent Application No. 2016-140360, filed on Jul. 15,2016, the entire contents of which are incorporated herein by reference.

FIELD

An embodiment of the present invention relates to a semiconductordevice, a display device including the semiconductor device, such as anorganic EL display device, and a manufacturing method thereof.

BACKGROUND

As a typical example exhibiting semiconductor properties, Group 14elements such as silicon and germanium are represented. Particularly,silicon has been utilized in almost all semiconductor devices because ofits wide availability, ease of processing, excellent semiconductorproperties, and ease of controlling properties. Similar to silicon, anoxide exemplified by an oxide of Group 13 elements such as indium andgallium also exhibits semiconductor properties and can be utilized in asemiconductor element such as a transistor. For example, as disclosed inJapanese patent application publication No. 2015-225104, Internationalpublication No. 2015-031037,and United States patent applicationpublication 2010/0182223, a semiconductor device in which both atransistor having a silicon-containing semiconductor (hereinafter,referred to as a silicon semiconductor) and a transistor having an oxidesemiconductor are incorporated and a display device using thesemiconductor device have been developed.

SUMMARY

An embodiment of the present invention is a display device including aplurality of pixels, and at least one of the plurality of pixels has afirst transistor and a light-emitting element. The first transistorincludes a gate electrode, a gate insulating film over ate electrode, anoxide semiconductor film over the gate insulating film, and a firstterminal and a second terminal electrically connected to the oxidesemiconductor film. The second terminal is electrically connected to thelight-emitting element. A region in which the first terminal overlapswith the gate electrode can be smaller than a region in which the secondterminal overlaps with the gate electrode.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1A and FIG. 1B are respectively schematic top and cross-sectionalviews of a semiconductor device according to an embodiment of thepresent invention;

FIG. 2 is a schematic top view of a semiconductor device according to anembodiment of the present invention;

FIG. 3A is a schematic top view of a semiconductor device according toan embodiment of the present invention, and FIG. 3B and FIG. 3C areschematic cross-sectional views of a semiconductor device according toan embodiment of the present invention;

FIG. 4A and FIG. 4B are respectively schematic top and cross-sectionalviews of a semiconductor device of according to embodiment of thepresent invention;

FIG. 5 is a perspective view of a display device according to anembodiment of the present invention;

FIG. 6 is a schematic top view of a display device according to anembodiment of the present invention;

FIG. 7 is an equivalent circuit of a pixel of a display device accordingto an embodiment of the present invention;

FIG. 8 is a schematic top view of a pixel of a display device accordingto an embodiment of the present invention;

FIG. 9 is a schematic cross-sectional view of a display device accordingto an embodiment of the present invention;

FIG. 10A and FIG. 10B are drawings for explaining an image-persistingphenomenon of a display element;

FIG. 11A and FIG. 11B are schematic cross-sectional views showing amanufacturing method of a display device according to an embodiment ofthe present invention;

FIG. 12A and FIG. 12B are schematic cross-sectional views showing amanufacturing method of a display device according to an embodiment ofthe present invention;

FIG. 13A and FIG. 13B are schematic cross-sectional views showing amanufacturing method of a display device according to an embodiment ofthe present invention;

FIG. 14A and FIG. 14B are schematic cross-sectional views showing amanufacturing method of a display device according to an embodiment ofthe present invention;

FIG. 15A and FIG. 15B are schematic cross-sectional views showing amanufacturing method of a display device according to an embodiment ofthe present invention;

FIG. 16 is a schematic cross-sectional view of a display deviceaccording to an embodiment of the present invention;

FIG. 17 is a schematic top view of a pixel of a display device accordingto an embodiment of the present invention; and

FIG. 18 is a schematic top view of a pixel of a display device accordingto an embodiment of the present invention.

DESCRIPTION OF EMBODIMENTS

Hereinafter, the embodiments of the present invention are explained withreference to the drawings. The invention can be implemented in a varietyof different modes within its concept and should not be interpreted onlywithin the disclosure of the embodiments exemplified below.

The drawings may be illustrated so that the width, thickness, shape, andthe like are illustrated more schematically compared with those of theactual modes in order to provide a clearer explanation. However, theyare only an example, and do not limit the interpretation of theinvention. In the specification and the drawings, the same referencenumber is provided to an element that is the same as that which appearsin preceding drawings, and a detailed explanation may be omitted asappropriate.

In the present invention, when a plurality of films is formed byprocessing one film, the plurality of films may have functions or rulesdifferent from each other. However, the plurality of films originatesfrom a film which is formed as the same layer in the same process.Therefore, the plurality of films is defined as films existing in thesame layer.

In the specification and the scope of claims, unless specificallystated, when a state is expressed where a structure is arranged “over”another structure, such an expression includes both a case where thesubstrate is arranged immediately above the “other structure” so as tobe in contact with the “other structure” and a case where the structureis arranged over the “other structure” with an additional structuretherebetween.

<First Embodiment>

In the present embodiment, a structure of a semiconductor deviceaccording to an embodiment of the present invention is explained byusing FIG. 1A to FIG. 3C.

1. Semiconductor Device 100

A schematic top view of a semiconductor device 100 according to thepresent embodiment is shown in FIG. 1A, and a schematic cross-sectionalview along a chain line A-B of FIG. 1A is illustrated in FIG. 1B. Thesemiconductor device 100 is a transistor and possesses a gate electrode102, a gate insulating film 104 over the gate electrode 102, a film 106(hereinafter, referred to as an oxide semiconductor film) located overthe gate insulating film 104 and including an oxide semiconductor, and afirst terminal 108 and a second terminal 110 located over andelectrically connected to the oxide semiconductor film 106. The oxidesemiconductor film 106 overlaps with the gate electrode 102. As shown inFIG. 1A, the entire bottom surface of the oxide semiconductor film 106may overlap with the gate electrode 102. Alternatively, the entire topsurface of the gate electrode 102 may be covered by the oxidesemiconductor film 106. The semiconductor device 100 may be disposedover an insulating film 112 and the like, for example. In FIG. 1A andFIG. 1B, the semiconductor device 100 is illustrated so that the secondterminal 110 is in contact with a part of a side surface of the oxidesemiconductor film 106. However, it is not always necessary that thesecond terminal 110 is in contact with the side surface of the oxidesemiconductor film 106.

In the present embodiment, the semiconductor device 100 can be designedso that a width of the first terminal 108 is smaller than a width of thesecond terminal 110. That is, a region in which the first terminal 108overlaps with the gate electrode 102 may be smaller than a region inwhich the second terminal 110 overlaps with the gate electrode 102. Inother words, a region in which the first terminal 108 overlaps with theoxide semiconductor film 106 may be smaller than a region in which thesecond terminal 110 overlaps with the oxide semiconductor film 106.Therefore, in the case where a side of the oxide semiconductor film 106overlapping with the first terminal 108 is defined as a first side 114and a side opposing the first side 114 and overlapping with the secondterminal 110 is defined as a second side 116, a portion of the firstside 114 overlapping with the first terminal 108 may be shorter than aportion of the second side 116 overlapping with the second terminal 110.The region in which the second terminal 110 overlaps with the oxidesemiconductor film 106 may be twice to twenty times, three times to tentimes, or five times to ten times the region in which the first terminal108 overlaps with the oxide semiconductor film 106.

In the semiconductor device 100, when a potential difference larger thana threshold voltage of the semiconductor device 100 is provided betweenthe gate electrode 102 and the first terminal 108, a current flows asindicated by the dotted arrows in FIG. 1A, and not only a straightcurrent path but also a curved current path are formed. Hence, exceptthe regions (surrounded by a dotted circle in the drawing) close to bothedge portions of the first side 114 of the oxide semiconductor film 106,almost the entire oxide semiconductor film 106 can be utilized as acurrent path. Therefore, a channel width can be maintained even if thewidth of the first terminal 108 is smaller than the width of the secondterminal 110.

On the other hand, although the regions close to both edge portions ofthe first side 114 of the oxide semiconductor film 106 do not functionas a current path, these regions exist in a floating state and behave asan insulating film. Therefore, no parasitic capacitance is formedbecause no electric field is provided over and under the gate insulatingfilm 104 overlapping with these regions. Additionally, as describedabove, the width of the first terminal 108 is smaller than the width ofthe second terminal 110. Hence, the use of the structure shown in thepresent embodiment enables extremely large reduction in parasiticcapacitance formed by the first terminal 108 and the gate electrode 102.

2. Semiconductor Device 120

In FIG. 1A, the oxide semiconductor film 106 is represented so as tohave a rectangular shape. However, the shape of the oxide semiconductorfilm 106 is not limited to this shape and may be square. Furthermore, itis possible to employ a shape in which regions which do not provide alarge contribution to the current path are removed. For example, asshown in a semiconductor device 120 of FIG. 2, the first side 114 of theoxide semiconductor film 106 may be shorter than the second side 116. Inthe semiconductor device 120, the oxide semiconductor film 106 has oneor more sides between the first side 114 and a side perpendicularlyintersecting the first side 114, and these sides incline from the firstside 114 and the second side 116. However, the first side 114 may belinked to the side perpendicularly intersecting the first side 114 via acurve in the oxide semiconductor film 106. Alternatively, thesemiconductor film 106 having a trapezoidal shape may be used.

3. Semiconductor Device 130

The second terminal 110 may have a shape so as to surround a part of thefirst terminal 108. For example, as exemplified by a semiconductordevice 130 of FIG. 3A, a planer shape of the second terminal 110 may bean open U-shape, and the first terminal 108 may be arranged so as tointersect an opening of this shape as shown in the cross-sectional views(FIG. 3B and FIG. 3C) along chain lines C-D and E-F of FIG. 3A.Application of such a structure allows further expansion of the channelwidth compared with that of the semiconductor device 100, therebyincreasing current-driving force. In this structure, as shown in FIG. 3Aand FIG. 3C, the semiconductor film 106 possesses a region sandwichedbetween a part of the first terminal 108 and a part of the secondterminal 110. As indicated by the dotted arrows of FIG. 3A, it ispossible to flow current in two opposite directions from the firstterminal 108 to the second terminal 110 in this region.

The first terminals 108 and the second terminals 110 of thesemiconductor devices 100, 120, and 130 correspond to a source electrodeand a drain electrode of a transistor. In the present specification andclaims, a source electrode and a drain electrode of a transistor arerepresented as a terminal because they may be interchanged depending ona direction of current or a polarity of a transistor. Therefore, thefirst terminal 108 and the second terminal 110 may function as a sourceelectrode and a drain electrode, respectively, and still may function asa drain electrode and a source electrode, respectively

<Second Embodiment>

In the present embodiment, a semiconductor device 140 in which thesemiconductor device 100 shown in the First Embodiment and a capacitorelement (hereinafter, referred to as a capacitor) are stacked isexplained by using FIG. 4A and FIG. 4B. FIG. 4A is a schematic top viewof the semiconductor device 140, and FIG. 4B is a schematiccross-sectional view along a broken line G-H of FIG. 4A. Explanation ofthe structures the same as those of the First Embodiment may be omitted.

The semiconductor device 140 has a structure in which the semiconductordevice 100 serving as a transistor is stacked over a capacitor 150.Specifically, the semiconductor device 140 possesses a first electrode142 and an insulating film 144 over the first electrode 142. Thesemiconductor device 140 further has the semiconductor device 100 overthe insulating film 144. As described in the First Embodiment, thesemiconductor device 100 includes the gate electrode 102, the gateinsulating film 104, the oxide semiconductor film 106, the firstterminal 108, and the second terminal 110. In the semiconductor device140, the gate electrode 102 overlaps with the first electrode 142 withthe insulating film 144 sandwiched therebetween to form the capacitor150 and also functions as the gate electrode of the semiconductor device100 In other words, the gate electrode 102 is shared by thesemiconductor device 100 serving as a transistor and the capacitor 150.The insulating film 144 serves as a dielectric of the capacitor 150.

The entire a bottom surface of the gate electrode 102 overlaps with thefirst electrode 142 in FIG. 4A. However, the structure of thesemiconductor device 140 is not limited thereto, and the entire firstelectrode 142 may overlap with the gate electrode 102.

Compared with a case where the capacitor 150 and the semiconductordevice 100 are arranged so as not to be stacked with each other, thesemiconductor device 140 can be reduced in area by stacking thecapacitor 150 and the semiconductor device 100, allowing miniaturizationof a variety of devices including the semiconductor device 140. Forexample, a capacitor occupies a large area in pixels of many displaydevices. Hence, in the case where the semiconductor device 140 is usedin a pixel, it is not necessary to increase an area of the pixel even ifthe semiconductor device 100 with a large size is formed over a largecapacitor. Accordingly, the application of the present embodimentenables securement of a large channel width and reduction of a parasiticcapacitance formed by the first terminal 108 and the gate electrode 102without decreasing an aperture ratio of a pixel and resolution ofdisplay.

Although not shown, the semiconductor device 120 or 130 of the FirstEmbodiment may be stacked with the capacitor 148.

<Third Embodiment>

In the present embodiment, a display device including the semiconductordevice 100, 120, 130, or 140 described in the First or Second Embodimentis explained by using FIG. 5 to FIG. 9. Explanation of the structuresthe same as those of the First and Second Embodiments may be omitted.

1. Outline Structure

A display device 200 of the present embodiment possesses a displayregion 206 including a plurality of pixels 204 arranged in row andcolumn directions, gate-side driver circuits 208, and a source-sidedriver circuit 210 over one surface (top surface) of a substrate 202.The display region 206, the gate-side driver circuits 208, and thesource-side driver circuit 210 are disposed between the substrate 202and an opposing substrate 216.

Display elements such as a light-emitting element and a liquid crystalelement giving colors different from one another can be disposed in theplurality of pixels 204, by which full-color display can be conducted.For example, display elements providing red, green, and blue colors maybe arranged in three pixels 204, respectively. Alternatively, displayelements exhibiting white color may be used in all pixels 204, andfull-color display may be performed by using a color filter to extractred, green, or blue color from the respective pixels 204. The colorsfinally extracted are not limited to a combination of red, green, andblue colors. For instance, four kinds of colors of red, green, blue, andwhite may be respectively extracted from four pixels 204. Thearrangement of the pixels 204 is also not limited, and a stripearrangement, a delta arrangement, a Pentile arrangement, and the likecan be employed.

As shown in FIG. 6, a variety of wirings exemplified by first scanninglines 220, second scanning lines 226, and image-signal lines 222 extendin a direction towards the display region 206 from the gate-side drivercircuits 208 and the source-side driver circuit 210 and are connected tothe respective pixels 204. Wirings 214 extend to a side surface of thesubstrate 202 (short side of the substrate 202) from the source-sidedriver circuit 210 and are exposed at an end portion of the substrate202 to form terminals 212. The terminals 212 are connected to aconnector (not shown) such as a flexible printed circuit (FPC). Controlsignals and image signals supplied from an external circuit (not shown)are input to the gate-side driver circuits 208 and the source-sidedriver circuit 210, and the image signals are provided to the pixels 204through the source-side driver circuit 210, by which the displayelements of the pixels 204 are controlled, and images are displayed onthe display region 206. In the present embodiment, two gate-side drivercircuits 208 are arranged so as to sandwich the display region 206.However, only a single gate-side driver circuit 208 may be employed.Furthermore, both or one of the gate-side driver circuits 108 and thesource-side driver circuit 210 may not be directly formed over thesubstrate 102, and a driver circuit fabricated over a differentsubstrate may be mounted over connector.

2. Pixel Circuit

FIG. 7 shows an example of equivalent circuits of the pixel 204. Thepixel 204 is connected to the first scanning line 220, the secondscanning line 226, a third scanning line 228, the image-signal line 22 acurrent-supplying line 224, and a reset power-source line 230. The firstscanning line 220, the second scanning line 226, and the third scanningline 228 extend in the row direction from the gate-side driver circuits208 through the plurality of pixels 204. On the other hand, the imagesignal line 222 intersects the first scanning line 220, the secondscanning line 226, and the third scanning line 228 substantiallyperpendicularly and extends in the column direction through theplurality of pixels 204. The current-supplying line 224 and the resetpower-source line 230 are represented so as to extend in the columndirection in FIG. 7. However, they may extend in the row direction or inthe row and column directions to form a mesh shape.

The pixel 204 possesses, as a semiconductor element, a first transistor240, a second transistor 242, a third transistor 244, a fourthtransistor 246, a capacitor (storage capacitor) 248, and the displayelement 250. The semiconductor device 100, 120, or 130 described in theFirst Embodiment can be used for the first transistor 240. Additionally,the semiconductor device 140 shown in the Second Embodiment can beemployed as the first transistor 240 and the capacitor 248, and thecapacitor 248 and the first transistor 240 can be stacked with eachother. In the following explanation, explanation is given for an examplewhere the semiconductor device 140 described in the Second Embodiment isused as the capacitor 248 and the first transistor 240. A connectionpoint of the first transistor 240 and the display element 250 isreferred to as a node X.

Note that the equivalent circuit shown in FIG. 7 is simply an exampleand the number of the transistors is not limited to four and may be two,three, five or more. The number of the transistors can be reduced byproviding the fourth transistor 246 in the gate-side driver circuit 208without forming the fourth transistor 246 in the pixel 204. In thiscase, the reset power-source line 230 can be extended in the rowdirection from the gate-side driver circuits 208. Furthermore, thenumber of the capacitors is not limited to one, and a plurality ofcapacitors may be included. The combination of the aforementionedwirings is also an example: another wiring may be provided, and a partof the aforementioned wirings may be shared by the plurality of pixels204.

The display element 250 is selected from a liquid crystal element and alight-emitting element. In the present embodiment, an example isdemonstrated in which a light-emitting element is used as the displayelement 250. As a light-emitting element, a self-emission type elementsuch as an organic electroluminescence (EL) element is represented. Theorganic EL element includes a pixel electrode, an opposing electrode,and an EL layer sandwiched therebetween.

The second scanning line 226 is connected to a gate electrode of thethird transistor 244, and a control signal BO is input to the gateelectrode of the third transistor 244. A first terminal of the thirdtransistor 244 is connected to the power-supplying line 224 and appliedwith a high potential PVDD. A second terminal of the third transistor244 is connected to a first terminal of the first transistor 240. Thefirst terminal of the first transistor 240 corresponds to the firstterminal 108 of the semiconductor device 140 shown in FIG. 4A and FIG.4B. A gate electrode of the second transistor 242 is connected to thefirst scanning line 220 and applied with a control signal SG. A firstterminal of the second transistor 242 is connected to the image-signalline 222 and applied with an image signal Vsig or an initializing signalVini. A second terminal of the second transistor 242 is connected a gateelectrode of the first transistor 240 and one electrode (secondelectrode) of the capacitor 248. The gate electrode of the firsttransistor 240 and the one electrode of the capacitor 248 are shared andutilized as the gate electrode 102 of the semiconductor device 140 shownin FIG. 4A and FIG. 4B.

A second terminal of the first transistor 240 corresponds to the secondterminal 110 of the semiconductor device 140 and is connected to theother electrode (first electrode) of the capacitor 248 and the pixelelectrode of the display element 250. The other electrode of thecapacitor 248 corresponds to the first electrode 142 of thesemiconductor device 140 shown in FIG. 4A and FIG. 4B.

A gate electrode of the fourth transistor 246 is connected to the thirdscanning line 228 and input with a control signal RG. A first terminalof the fourth transistor 246 is connected to the reset power-source line230 and applied with a reset potential Vrst. A second terminal of thefourth transistor 246 is electrically connected to the other electrodeof the capacitor 248 and the pixel electrode of the display element 250.The opposing electrode of the display element 250 is applied with a lowpotential PVSS.

Hereinafter, operation of the pixel 204 is explained. Operation of thepixel 204 is divided into an initializing period, an offset-cancelingperiod, an image-signal writing and mobility-canceling period, and anemission period.

The initializing period is explained. The control signal RG is input thegate electrode of the fourth transistor 246 to turn on the fourthtransistor 246, With this operation, the reset potential Vrst isprovided to the first electrode of the capacitor 248, the pixelelectrode, and the second terminal of the first transistor 240 from thereset power-source line 230, by which a potential of the second terminalof the first transistor 240 is reset. Simultaneously, in the displayelement 250, a potential difference between the pixel electrode and theopposing electrode becomes zero or lower than an emission-startingvoltage, and emission is terminated if the display element 250 is in anemission state.

After that, the control signal SG is applied to the gate electrode ofthe second transistor 242 to turn on the second transistor 242. At thistime, the image-signal line 222 is applied with the initializing signalVini, by which initialization is performed so that a potential of thegate electrode of the first transistor 240 becomes a potentialcorresponding to the initialization signal Vini.

Next, the offset-canceling period is explained. The fourth transistor246 is turned off, and the control signal SG is input to the gateelectrode of the second transistor 242 to turn on the second transistor242. Furthermore, the gate electrode of the third transistor 244 isprovided with the control signal BG to turn on the third transistor 244.At his time, a gate potential becomes Vini, and a potential of the firstterminal (drain potential) becomes PVDD in the first transistor 240,while a potential of the node X increases until a potential differencebetween the gate electrode of the first transistor 240 and the node Xbecomes almost the same as a threshold voltage of the first transistor240, The increase at this time depends on the threshold of thetransistor 240 in each pixel 204.

After the offset-canceling operation is completed, the operation shiftsto the image-signal writing and mobility-canceling period. The imagesignal line 222 is input with the image signal Vsig, by which the imagesignal Vsig is written to the gate electrode of the first transistor240.

In a period after the writing of the image signal Vsig is started andbefore the second transistor 242 is turned off, the potential of thenode X begins to increase because the first transistor 240 is turned offby writing Vsig. An increasing rate of the potential of the node Xbecomes large with increasing mobility of the first transistor 240.Therefore, at the moment when the second transistor 242 is turned off, apotential difference between the gate electrode of the first transistor240 and the node X is relatively small in the case of a transistor witha high mobility, while the difference is relatively large in the case ofa transistor with a low mobility, With this operation, the mobility iscanceled.

After that, the second transistor 242 is turned off by which the gateelectrode of the first transistor 240 becomes a floating state. Sincethe capacitor 248 is provided to the gate electrode and the secondterminal of the first transistor 240, variation of the potential of thesecond terminal causes variation of the potential of the gate electrodedue to a bootstrap operation.

After that, the operation shifts to the emission period. Current flowsbetween the first terminal and the second terminal of the firsttransistor 240, and display is maintained by the control signal BG untilthe third transistor 244 is turned off by the control signal BG.

3. Pixel Structure

A schematic top view of the pixel 204 is shown in FIG. 8, and schematiccross-sectional views along chain lines J-K and L-M are represented inFIG. 9.

In FIG. 8, the display element 250 is not illustrated. In the pixel 204,the capacitor 248 and the first transistor 240 are stacked over thesubstrate 202 with an undercoat 258 sandwiched therebetween (see FIG.9), and this structure corresponds to the semiconductor device 140. Thefirst transistor 240 has the gate electrode 260, a gate insulating film262 (not shown in FIG. 8) over the gate electrode 260, an oxidesemiconductor film 264 over the gate insulating film 262, and the firstterminal 266 and the second terminal 268 over the oxide semiconductorfilm 264. The capacitor 248 has the first electrode 270, an insulatingfilm 272 (not shown in FIG. 8) located over the first electrode 270 andfunctioning as a dielectric, and the gate electrode 260 over theinsulating film 272, and the gate electrode 260 is shared by the firsttransistor 240 and the capacitor 248. The capacitor 248 corresponds tothe capacitor 150 of the semiconductor device 140.

The second transistor 242 has a semiconductor film 274 over theundercoat 258 over which e insulating film 272 functioning as a gateinsulating film of the second transistor 242 is provided. The insulatingfilm 272 functions as a gate insulating film in the third transistor 244and the fourth transistor 246 and also shared by the capacitor 248 toserve as the dielectric in the capacitor 248.

The second transistor 242 further possesses the gate electrode 276 overthe semiconductor film 274 and the insulating film 272, and the gateelectrode 276 corresponds to a part of the first scanning line 220 (aportion protruding upward in FIG. 8). The gate insulating film 262 ofthe first transistor 240 extends over and covers the gate electrode 276of the second transistor 242 and functions as an interlayer film in thesecond transistor 242. The image-signal line 222 and the second terminal278 are provided so as to cover contact holes (dotted circles in FIG. 8.The same is applied hereinafter) formed in the gate insulating film 262and the insulating film 272 and electrically connected to thesemiconductor film 274. Therefore, the image-signal line 222 alsofunctions as the first terminal of the second transistor 242. The secondterminal 278 is electrically connected, through a contact hole, to thegate electrode 260 of the first transistor 240 which also functions asthe one electrode of the capacitor 248 (see, FIG. 9).

The third transistor 244 has a semiconductor film 280, and a part of thesecond scanning line 226 (a portion protruding downward in FIG. 8)functions as the gate electrode. The semiconductor film 280 iselectrically connected to the current-supplying line 224 and the secondterminal 282 through contact holes formed thereover. Hence, thecurrent-supplying line 224 further functions as the first terminal ofthe third transistor 244. Additionally, the second terminal 282 alsoserves as the first terminal 266 of the first transistor 240.

The fourth transistor 246 has a semiconductor film 284, and a part ofthe third scanning line 228 (a portion protruding upward in FIG. 8)functions as the gate electrode. The semiconductor film 284 iselectrically connected to the reset power-source line 230 and the secondterminal 286 in contact holes formed thereover. The second terminal 286also serves as the second terminal 268 of the first transistor 240.Additionally, the second terminal 286 is connected to the pixelelectrode 252 in a contact hole 288 formed thereover.

As described in the First and Second Embodiments, the first transistor240 possesses the semiconductor film 264 including an oxidesemiconductor.

On the other hand, there is no limitation to an element included in thesemiconductor films 274, 280, and 284 of the second transistor 242, thethird transistor 244, and the fourth transistor 246, and silicon,germanium, an oxide semiconductor, or the like may be included.Crystallinity of the oxide semiconductor film 264 and the semiconductorfilms 274, 280, and 284 is not limited and may be single crystalline,polycrystalline, microcrystalline, or amorphous.

The structures of the second transistor 242, the third transistor 244,and the fourth transistor 246 are not limited and may be a top-gate typeor a bottom-gate type. Furthermore, positional relationships of thesemiconductor films 274, 280, and 284 of the second transistor 242, thethird transistor 244, and the fourth transistor 246 with respect to thefirst terminals and the second terminals connected thereto are notlimited and may be a bottom-contact type or a top-contact type. In eachof the second transistor 242, the third transistor 244, and the fourthtransistor 246, the first terminal and the second terminal may overlapwith the gate electrode or form a so-called self-aligned structure inwhich the first terminal and the second terminal do not overlap with thegate electrode. It is not necessary that only a single gate electrode isprovided, and the second transistor 242, the third transistor 244, andthe fourth transistor 246 may have a multi-gate structure having two ormore gate electrodes.

A leveling film 290 is provided over the first transistor 240 and thesecond transistor 242 (FIG. 9) and absorbs depressions, projections, andinclines caused by the capacitor 248, the first transistor 240, and thesecond transistor 242 to give a flat top surface. The contact hole 288is formed in the leveling film 290, and the pixel electrode 252 iselectrically connected to the second terminal 268 of the firsttransistor 240 and the second terminal 286 of the fourth transistor 246in the contact hole 288.

A partition 292 covering an edge portion of the pixel electrode 252 andabsorbing depressions and projections caused by the contact hole 288 isformed over the pixel electrode 252. The EL layer 254 and the opposingelectrode 256 are arranged over the pixel electrode 252 and thepartition wall 292, and the display element 250 is structured by thepixel electrode 252, the EL layer 254, and the opposing electrode 256.In the present specification and claims, the EL layer 254 means all thelayers sandwiched between the pixel electrode 252 and the opposingelectrode 256. Carriers (electrons and holes) are injected to the ELlayer 254 from the pixel electrode 252 and the opposing electrode 256,and light emission is obtained through a process in which an excitedstate generated by carrier recombination relaxes to a ground state.

The display device 200 may possess a passivation film (sealing film) 294over the opposing electrode 256 as an optional structure. In the presentembodiment, the passivation film 294 has a three-layer structureincluding a first layer 296, a second layer 298, and a third layer 300as shown in FIG. 9. Specifically, the passivation film 294 has the firstlayer 296 including an inorganic insulator, the second layer 298including an organic insulator, and the third layer 300 including aninorganic insulator. The passivation film 294 may have a single-layerstructure or may be structured with a plurality of layers asillustrated.

Since a transistor including an oxide semiconductor has a lowfiled-effect mobility compared with a transistor including a siliconsemiconductor, it is generally difficult to flow a large current in atransistor including an oxide semiconductor, However, similar to thesemiconductor device 140 described in the Second Embodiment, thecapacitor 248 and the first transistor 240 are stacked with each otherin the display device 200 of the present embodiment. With this stackedstructure, it is not required to enlarge the pixel 204 even if a size ofthe first transistor 240 is increased because the capacitor 248 occupiesa large area in the pixel 204. Therefore, it is possible to secure alarge channel width in the first transistor 240 without decreasing anaperture ratio and resolution of display, by which a large current canbe flowed. Since the second transistor 242 is connected to the displayelement 250, a large current can be flowed in the display element 250,thereby enabling display at a high luminance.

As described above, since the first transistor 240 is connected to thedisplay element 250 in series, variation in electric characteristics(threshold voltage) of the first transistor 240 influences variation inluminance between the pixels 204, resulting in a reduction of displayquality. However, variation in characteristics of a transistor having anoxide semiconductor is smaller than that of a transistor including asilicon transistor, particularly that of a transistor includingpolycrystalline silicon (polysilicon). Hence, application of the firsttransistor 240 shown in the present embodiment to the transistorconnected to the display element 250 allows production of a displaydevice with high display quality.

Moreover, as described above, the insulating film 272 serving as thedielectric of the capacitor 248 also functions as the gate insulatingfilm in the second transistor 242, the third transistor 244, and thefourth transistor 246. A thickness of a gate insulating film of atransistor is generally as small as 50 nm to 100 nm. Thus, the capacitor248 is able to possess a large capacitance.

Accordingly, it is possible to maintain the potential of the gateelectrode 260 of the first transistor 240 for a long time, and a writingfrequency of the image signal Vsig from the image-signal line 222 can besignificantly decreased, thereby reducing power consumption.

Furthermore, as described in the First and Second Embodiments, theparasitic capacitance formed by the first terminal 266 and the gateelectrode 260 of the first transistor 240 is small. Hence, as explainedbelow, it is possible to suppress a decrease in luminance and animage-persisting phenomenon caused by the parasitic capacitance formedby the first terminal 266 and the gate electrode 266. Hereinafter, forthe sake of convenience, explanation is provided for the case where thefirst terminal 266 and the second terminal 268 of the first transistor240 shown in FIG. 7 and FIG. 8 are a drain and a source, respectively.

As described above, the second transistor 242 is turned off after theimage signal Vsig is written to the gate electrode 260 of the firsttransistor 240, by which the gate electrode 260 of the first transistor240 becomes a floating state. Since a current flowing between the drain266 and the source 268 of the first transistor 240 flows in the displayelement 250, the potential of the source 268 increases. Therefore, thepotential of the gate electrode 260 of the first transistor 240 alsoincreases due to the bootstrap operation. Ideally, an increase of thepotential of the source 268 is the same as an increase of the potentialof the gate electrode 260.

However, as indicated in the equivalent circuit of FIG. 7 and thecross-sectional view of FIG. 10A, a parasitic capacitance C_(gd) existsbetween the gate electrode 260 and the drain 266. This C_(gd) reducesthe increase of the potential of the gate electrode 260 compared withthat of the source 268. This phenomenon is called a bootstrap loss (BSloss). At this time, a decrease ΔV_(gs) of the potential differenceV_(gs) between the gate electrode 260 and the source 268 follows thefollowing equation:

${\Delta \; {Vgs}} = {\Delta \; {Vs} \times \frac{Cgd}{{Cgd} + {Cs}}}$

where ΔV_(s) is the increase of the potential of the source 268, andC_(s) is a capacitance of the capacitor 248. According to this equation,the BS loss is 0 when C_(gd) is 0, and the potential difference ween thegate electrode 260 and the source 268 is maintained (ΔV_(gs)=0). On theother hand, an increase in C_(gd) leads to an increase of ΔV_(gs) andthe BS loss. As a result, although a sufficient potential difference isprovided between the gate electrode 260 and the source 268 at an earlystage of the emission, the potential difference between the gateelectrode 260 and the source 268 decreases before the emission reaches astationary state (ΔV_(gs)>0). Accordingly, a potential of the pixelelectrode 252 cannot sufficiently increase to obtain an intendedluminance.

However, similar to the First and Second Embodiments, a width of thedrain 266 of the first transistor 240 is smaller than that of the source268 in the display device 200. Hence, C_(gd) can be significantlyreduced and the BS loss can be decreased, by which an intended luminanceor a luminance substantially the same as the intended luminance can beobtained.

Explanation with respect to the image-persisting phenomenon of thedisplay element 250 is given by using FIG. 10B. Curves 160 and 162 ofthe graph schematically represent V-I curves of the first transistor240, and a current I_(ds) flowing between the drain 266 and the source268 with respect to a potential difference V_(ds) between the drain 266and the source 268 is plotted when a constant potential is providedbetween the gate electrode 260 and the source 268. The curve 160 is aV-I curve when the BS loss is small. In this case, a relatively largepotential difference is maintained between the gate electrode 260 andthe source 268 due to the bootstrap operation. On the other hand, thecurve 162 is a V-I curve when the BS loss is large. Compared with thecase where the BS loss is small, the potential difference between thegate electrode 260 and the source 268 is small. Therefore, in the casewhere V_(ds) is the same, a large current I_(ds) flows when the BS lossis small (curve 160).

Curves 164 and 166 schematically represent V-I curves of the displayelement 250. That is, these curves are plots of a current flowing in theEL layer 254 with respect to a potential difference applied between thepixel electrode 252 and the opposing electrode 256. The curves 164 and166 are V-I curves of the display element 250 before and afterdeterioration, respectively. As shown in FIG. 103, the curves 160 and162 start from the high potential PVDD. Furthermore, the curves 164 and166 start from the low potential PVSS. Since the display element 250 andthe first transistor 240 are connected in series, the current amount thesame. Accordingly, intersections of e curve 160 with the curves 164 and166 and intersections of the curve 162 with the curves 164 and 166 areoperation points of the display device 250. The potential of the node Xis a potential X(C) and a potential X(A) at the intersections C and A,respectively. At the intersection C, the source-drain voltage of thefirst transistor 240 is a voltage V_(ds)(C), and the anode (pixelelectrode 252)-cathode (opposing electrode 256) voltage of the displayelement 250 is V_(ac)(C). At the intersection A, the source-drainvoltage of the first transistor 240 is a voltage V_(ds)(A), and theanode-cathode voltage of the display element 250 is V_(ac)(A).

In the case where the BS loss is small, the operation point of thedisplay element 250 is the intersection A of the curve 160 with thecurve 164 before deterioration of the display element 250. Since I_(ds)is the same as the current following in the display element 250, theluminance of the display element 250 is determined by the product of thecurrent at the intersection A by current efficiency of the displayelement 250.

When the display element 250 is deteriorated and the V-I characteristicshifts to the curve 166, the operation point of the display element 250shifts to the intersection B in the case where the BS loss is small. Inthis case, a decrease of I_(ds) due to a decrease of V_(ds) can besuppressed by driving the first transistor 240 in a saturated region.Hence, a reduction in luminance can be suppressed to some extent even ifthe display element 250 is deteriorated as long as a remarkable decreasein current efficiency does not occur.

On the contrary, when the BS loss is large, the V-I curve shifts tocurve 162. Accordingly, when the display element 250 is deteriorated andthe V-I characteristic shifts to the curve 166, the operation pointshifts to the intersection C, and I_(ds), i.e., the current flowing inthe display element 250, is significantly decreased. As a result, theluminance is drastically decreased, which is recognized as theimage-persisting phenomenon. Furthermore, when the BS loss is large, theV-I curve shifts to the curve 162. Thus, the operation point shifts tothe intersection D, and I_(ds) is also enormously decreased. Hence, theluminance is markedly decreased, which is recognized as theimage-persisting phenomenon.

As described above, the BS loss greatly depends on C_(gd). However, thewidth of the drain 266 of the first transistor 240 is smaller than thatof the source 268 in the display device 200 of the present embodiment.Hence, C_(gd) can be significantly decreased, by which the BS loss canbe reduced. As a result, the decrease in luminance and theimage-persisting phenomenon can be suppressed. Therefore, theapplication of the present embodiment allows production of a highlyreliable display device capable of high-quality display.

<Fourth Embodiment>

In the present embodiment, explanation is given with respect to amanufacturing method of the display device 200 described in the ThirdEmbodiment by using FIG. 9 and FIG. 11A to FIG. 15B. FIG. 11A to FIG.11B are cross-sectional views along broken lines J-K and L-M of FIG. 8.Explanation of the structures the same as those of the First to ThirdEmbodiment may be omitted.

1. Capacitor

First, the undercoat 258 is formed over the substrate 202 (FIG. 11A).The substrate 202 has a function to support a variety of semiconductorelements formed thereover. Therefore, a material having heat resistanceto a process temperature of each semiconductor element formed thereoverand chemical stability to chemicals used in the process may be used.Specifically, the substrate 202 may include glass, quartz, plastics, ametal, ceramics, and the like. When flexibility is provided to thedisplay device 200, a polymer material can be used. For example, apolymer material exemplified by a polyimide, a polyamide, a polyester,and a polycarbonate can be employed. Note that, when a flexible displaydevice 200 is fabricated, the substrate 202 may be called a basematerial or a base film.

The undercoat 258 is a film having a function to prevent impurities suchas an alkaline metal from diffusing to each semiconductor element andthe like from the substrate 202 and can include an inorganic insulatorsuch as silicon nitride, silicon oxide, silicon nitride oxide, andsilicon oxynitride. The undercoat 258 can be formed to have asingle-layer or stacked-layer structure by applying a chemical vapordeposition method (CVD method), a sputtering method, a laminationmethod, and the like. When a CVD method is employed, tetraalkoxysilaneand the like may be used as a raw material gas. A thickness of theundercoat 258 can be freely selected from a range from 50 nm to 1000 nmand is not necessarily constant over the substrate 202. The undercoat258 may have different thicknesses depending on position. For instance,when the undercoat 258 is configured with a plurality of layers, asilicon nitride-containing layer may be stacked over the substrate 202,and then a silicon oxide-containing layer may be stacked thereover.

When an impurity concentration in the substrate 202 is low, theundercoat 258 may not be provided or may be formed to cover a part ofthe substrate 202. For example, when a polyimide having a lowconcentration of an alkaline metal is employed as the substrate 202, theundercoat 258 may not be provided.

Next, the semiconductor film 274 and the first electrode 270 are formedover the undercoat 258 (FIG. 11A). For example, amorphous silicon (a-Si)with a thickness of approximately 50 nm to 100 nm is formed over theundercoat 258 with a CVD method and is crystallized by performing aheating treatment or irradiation of light such as a laser to transforminto a polysilicon film. The crystallization may be carried out in thepresence of a catalyst such as nickel. After that, the polysilicon filmis processed with etching to form the semiconductor film 274 and thefirst electrode 270. Although not shown, the semiconductor films 280 and284 are formed simultaneously with the semiconductor film 274.

Next, the semiconductor film 274 is masked, and an ion-implantationtreatment or an ion-doping treatment is conducted selectively on thefirst electrode 270. An element such as boron and aluminum imparting ap-type conductivity or an element such as phosphorus and nitrogenimparting an n-type conductivity is represented as an ion. With thisprocess, a conductivity sufficient for the first electrode 270 tofunction as the one electrode of the capacitor 248 can be obtained.

Next, the insulating film 272 is formed over the semiconductor film 274and the first electrode 270 (FIG. 11A). The insulating film 272 may havea single-layer structure or a stacked-layer structure and include aninorganic insulator usable in the undercoat 258. Alternatively, theinsulating film 272 may contain an insulator with high permittivity suchas hafnium oxide, zirconium oxide, aluminum oxide, or a mixed oxidethereof. Similar to the undercoat 258, the insulating film 272 can beformed by applying a sputtering method, a CVD method, or the like. Theinsulating film 272 functions as the dielectric film of the capacitor248 in addition to functioning as the gate insulating films of e secondtransistor 242, the third transistor 244, and the fourth transistor 246.

Next, a metal film is formed over the insulating film 272 and subjectedto processing with etching to form the gate electrode 276 of the secondtransistor 242 and the gate electrode 260 of the first transistor 240(FIG. 11B). Thus, these electrodes exist in the same layer. In thiscase, the wirings existing in the same layer as these electrodes, e.g.,the second scanning line 226, the third scanning line 238, and the like,are simultaneously formed. Areas and positions of the first electrode270 and the gate electrode 260 may be adjusted so that the firstelectrode 270 is completely covered with the gate electrode 260 or alower surface of the gate electrode 260 completely overlaps with thefirst electrode 270. With this structure, variation in capacitancecaused by misalignment can be prevented.

The metal film can be formed by using a metal such as titanium,aluminum, copper, molybdenum, tungsten, and tantalum or an alloy thereofso as o have a single-layer or stacked layer structure. When the displaydevice 200 of the present invention possesses a large area, the use of ametal with a high conductivity, such as aluminum and copper, ispreferred in order to avoid signal delay. For example, a structure canbe employed in which aluminum or copper is sandwiched by a metal havinga relatively high melting-point, such as titanium and molybdenum.

Through the aforementioned processes, the capacitor 248 is fabricated.

2. Transistor

Next, the gate insulating film 262 is formed so as to cover the gateelectrodes 260 and 276 (FIG. 12A). The gate insulating film 262 may havea single-layer structure or a stacked-layer structure, The gateinsulating film 262 functions as the interlayer film in the secondtransistor 242, the third transistor 244, and the fourth transistor 246.

The gate insulating film 262 can be formed with the same method as thatfor the insulating film 272 and can include the same material as thatfor the insulating film 272. It is preferred to use a siliconoxide-containing insulating film in order to suppress carrier generationin the semiconductor film 264 formed thereover. When the gate insulatingfilm 262 has a stacked structure, a region in contact with thesemiconductor film 264 preferably contains silicon oxide.

When the gate insulating film 262 is formed, it is preferred that anatmosphere contain a hydrogen-containing gas such as hydrogen gas andwater vapor as little as possible, by which the gate insulating film 262with a small hydrogen composition and an oxygen composition close to orlarger than stoichiometry can be formed.

After forming the gate insulating film 262, an ion-implantationtreatment or an ion-doping treatment s performed on the semiconductorfilm 274 by using the gate electrode 276 as a mask. An element impartinga p-type conductivity, such as boron and aluminum, or an elementimparting an n-type conductivity, such as phosphorus and nitrogen, isrepresented as an ion. This process allows the formation of a channelregion in a region overlapping with the gate electrode 276 and asource/drain region in another region of the semiconductor film 274.Note that an ion-implantation treatment or an ion-doping treatment maybe carried out on the third transistor 244 and the fourth transistor 246as appropriate.

Next, the oxide semiconductor film 264 is formed over the gateinsulating film 262 so as to overlap with the first electrode 270 andthe gate electrode 260 (FIG. 12A). The oxide semiconductor film 264 mayinclude an oxide semiconductor which can be selected from Group 13elements such as indium and gallium. The semiconductor film 264 mayinclude a plurality of different Group 13 elements and may beindium-gallium-oxide (IGO). The semiconductor film 264 may furthercontain Group 12 elements and is exemplified byindium-gallium-zinc-oxide (IGZO). The semiconductor film 264 may includeGroup 14 elements such as tin or Group 4 elements such as titanium andzirconium.

The semiconductor film 264 is formed by utilizing a sputtering methodand the like at a thickness of 20 nm to 36 nm or 30 nm to 56 nm. When asputtering method is applied, the film formation can be conducted underan atmosphere containing oxygen gas, such as a mixed atmosphere of argonand oxygen gas. In this case, a partial pressure of argon may be lowerthan that of oxygen gas.

The oxide semiconductor film 264 preferably possesses few crystaldefects such as an oxygen defect. Hence, it is preferred to perform aheat treatment (annealing) on the oxide semiconductor film 264. The heattreatment may be conducted before patterning or after patterning theoxide semiconductor film 264. It is preferred that the heat treatment beperformed before the patterning because the oxide semiconductor film 264may decrease in volume (shrinking) by the heat treatment. The heattreatment may be conducted in the presence of nitrogen, dry air, oratmospheric air at a normal pressure or a reduced pressure. The heatingtemperature can be selected from a range of 250° C. to 500° C. or 350°C. to 450° C., and the heating time carp be selected from a range of 15minutes to 1 hour. However, the heat treatment can be conducted outsidethese temperature and time ranges. Oxygen is introduced or migrated tothe oxygen defects of the oxide semiconductor film 264 by the heattreatment which results in the oxide semiconductor film 264 having awell-defined structure, a small number of crystal defects, and highcrystallinity. Accordingly, the first transistor 240 having highreliability and excellent electrical properties such a low off currentand small variation in characteristics (threshold voltage).

Next, as shown in FIG. 12B, the insulating film 272 and the gateinsulating film 262 are processed with etching to form opening portionsexposing the semiconductor film 274 and the first electrode 270. Afterthat, the image-signal line 222, the second terminal 278 of the secondtransistor 242, the first terminal 266 and the second terminal 268 ofthe first transistor 240, the second terminal 286 of the fourthtransistor 246, and the like are formed (FIG. 13A). Therefore, theseterminals and wirings exist in the same layer. These terminals andwirings can be formed by applying a similar material, structure, andmethod to those for the formation of the gate electrode 260 and thefirst electrode 270 of the capacitor 248. Note that a thickness of theoxide semiconductor film 264 in the channel region may be smaller thanthat in a region covered by the first terminal 266 or the secondterminal 268. Although not shown, an insulating film for protecting thechannel region may be provided between the oxide semiconductor film 264and the first terminal 266 and the second terminal 268.

With the above processes, the first transistor 240 and the secondtransistor 242 are fabricated as well as the third transistor 244 andthe fourth transistor 246.

3. Display Element

Next, the leveling film 290 is formed so as to cover the firsttransistor 240 and the second transistor 242 (FIG. 13B). The levelingfilm 290 can be formed by using an organic insulator. A polymer materialsuch as an epoxy resin, an acrylic resin, a polyimide, a polyamide, apolyester, a polycarbonate, and a polysiloxane is represented as anorganic insulator, and the leveling film 290 can be formed with awet-type film-forming method such as a spin-coating method, an ink-jetmethod, a printing method, and a dip-coating method. The leveling film290 may have a stacked structure including a layer containing theaforementioned organic insulator and a layer containing an inorganicinsulator. In this case, a silicon-containing inorganic insulator suchas silicon oxide, silicon nitride, silicon nitride oxide, and siliconoxynitride is represented as an inorganic insulator, and the layercontaining an inorganic insulator can be formed with a sputtering methodor a CVD method.

Next, leveling film 290 is processed to form the contact hole 288 (FIG.14A). After that, the pixel electrode 252 is formed so as to cover thecontact hole 288 (FIG. 143), by which the pixel electrode 252 and thesecond terminal 268 of the first transistor 240 are electricallyconnected to each other.

When light emission o the display element 250 is extracted through thesubstrate 202, a material having a light-transmitting property, such asa conductive oxide exemplified by indium-tin-oxide (ITO) andindium-tin-zinc-oxide (IZO), can be used for the pixel electrode 252. Onthe other hand, when the light emission from the display element 250 isextracted from a side opposite to the substrate 202, a metal such asaluminum and silver or an alloy thereof can be used. Alternatively, astacked layer of the aforementioned metal or alloy and the conductiveoxide can be employed. For example, a stacked structure in which a metalis sandwiched by a conductive oxide (e.g., ITO/silver/ITO etc.) can beused.

Next a partition wall 292 is formed (FIG. 15A). The partition wall 292can be formed by using a material usable in the leveling film 290 with awet-type film-forming method. The partition wall 292 has an openingportion so as to expose a part of the pixel electrode 252, and an edgeportion of the opening preferably has a moderately tapered shape,thereby preventing generation of a defect in the EL layer 254 and theopposing electrode 256 formed later. The partition wall 292 also has afunction to absorb steps caused by the pixel electrode 252 and thecontact hole 288 as well as a function to electrically insulate thepixel electrodes 252 of the adjacent pixels 204 from each other. Thepartition wall 292 is also called a bank or a rib.

Next, the EL layer 254 is formed over the pixel electrode 252 (FIG.15B), The EL layer 254 is formed so as cover the pixel electrode 252 andthe partition wall 292. The EL layer 254 may be structured by a singlelayer or a plurality of layers. For example, the EL layer 254 can bestructured by appropriately combining a carrier-injection layer, acarrier-transporting layer, an emission layer, a carrier-blocking layer,an exciton-blocking layer, and the like. Moreover, the EL layer 254 maybe different in structure between adjacent pixels 204. For example, theEL layer 254 may be formed so that the emission layer is different butother layers are the same in structure between the adjacent pixels 204.With this structure, different emission colors can be obtained from theadjacent pixels 204, and full color display can be realized. On thecontrary, the same EL layer 254 may be used in all pixels 204. In thiscase, the EL layer 254 giving white emission may be formed so as to beshared by all pixels 204, and the wavelength of the light extracted fromeach pixel 204 may be selected by using a color filter and the like. TheEL layer 254 can be formed by applying an evaporation method or theaforementioned wet-type film-formation method.

Next, the opposing electrode 256 is formed over the EL layer 254 (FIG.15B). When the light emission from the display element 250 is extractedthrough the substrate 202, a metal such as aluminum and silver or analloy thereof can be used for the opposing electrode 256. On the otherhand, when the light-emission from the display element 250 is extractedthrough the opposing electrode 256, the opposing electrode 256 is formedby using the aforementioned metal or alloy so as to have a thicknesswhich allows visible light to pass therethrough. Alternatively, amaterial having a light-transmitting property, such as a conductiveoxide exemplified by ITO, IZO, and the like, can be used for theopposing electrode 256. Furthermore, a stacked structure of theaforementioned metal or alloy with the conductive oxide (e.g.,MG—Ag/ITO, etc.) can be employed in the opposing electrode 256. Theopposing electrode 256 can be formed with an evaporation method, asputtering method, and the like.

With the above processes, the display element 250 is fabricated.

A passivation film 294 may be disposed over the opposing electrode 256as an optional structure (FIG. 9). One of the functions of thepassivation film 294 is to prevent water from entering the precedentlyprepared display element 250 from outside. The passivation film 294 ispreferred to have a high gas-barrier property. For example, it ispreferred that the passivation film 294 be formed by using an inorganicmaterial such as silicon nitride, silicon oxide, silicon nitride oxide,and silicon oxynitride. Alternatively, an organic resin including anacrylic resin, a polysiloxane, a polyimide, a polyester, and the likemay be used. The passivation film 294 may have a single-layer structureor a stacked-layer structure.

When the passivation film 294 has the three-layer structure includingthe first layer 296, the second layer 298, and the third layer 300, thefirst layer 296 may include an inorganic insulator such as siliconoxide, silicon nitride, silicon nitride oxide, and silicon oxynitrideand may be formed by applying a CVD method or a sputtering method. As amaterial for the second layer 298, a polymer material selected from anepoxy resin, an acrylic resin, a polyimide, a polyester, apolycarbonate, a polysiloxane, and the like can be used. The secondlayer 298 can be formed with the aforementioned wet film-forming method.Alternatively, the second layer 298 may be formed by atomizing orgasifying oligomers functioning as a raw material of the polymermaterial at a reduced pressure, spraying the first layer 296 with theoligomers, and polymerizing the oligomers.

At this time, a polymerization initiator may be mixed in the oligomers.Additionally, the first layer 296 may be sprayed with the oligomerswhile cooling the substrate 202. The third layer 300 can be formed byapplying the same material and method as those for the first layer 296.

The opposing substrate 216 may be arranged over the passivation film 294as an optional structure (see, FIG. 5). The opposing substrate 216 isfixed to the substrate 202 with an adhesive (not shown). In this case, aspace between the opposing substrate 216 and the passivation film 294may be filled with an inert gas or a filler such as a resin.Alternatively, the passivation film 294 and the opposing substrate 216may be directly adhered with an adhesive. When the opposing substrate216 is fixed to the substrate 202, a gap therebetween may be adjusted byadding a spacer in the adhesive or the filler. Alternatively, astructure functioning as a spacer may be formed between the pixels 204.

Furthermore, a light-shielding film having an opening in a regionoverlapping with the emission region and a color filter in a regionoverlapping with the emission region may be disposed over the opposingsubstrate 216. The light-shielding film is formed by using a metal witha relatively low reflectance, such as chromium and molybdenum, or amixture of a resin material with a coloring material having a black orsimilar color. The light-shielding film has a function to shieldscattered or reflected external light and the like other than the lightdirectly obtained from the emission region. The color filter can beformed while changing its optical properties between adjacent pixels 204so that red emission, green emission, and blue emission are extracted.The light-shielding film and the color filter may be provided over theopposing substrate 216 with an undercoat film interposed therebetween,and an overcoat layer may be further arranged to cover thelight-shielding film and the color filter.

Through the above processes, the display device 200 described in theThird Embodiment is manufactured.

<Fifth Embodiment>

In the present embodiment, a display device 400 according to anembodiment of the present invention is explained by using FIG. 8 andFIG. 16. Explanation of the contents duplicated in the First to FourthEmbodiments may be omitted.

Schematic cross-sectional views of the display device 400 are shown inFIG. 16, FIG. 16 corresponds to the cross-sections along the chain linesJ-K and L-M in FIG. 8. A difference from the display device 200 is thatthe display device 400 possesses, over the first transistor 240, asecond insulating film 402 in contact with the first terminal 266, thesecond terminal 268, and the oxide semiconductor film 264. The secondinsulating film 402 extends to the second transistor 242 and to thethird transistor 244 and the fourth transistor 246 which are notillustrated and is sandwiched between the image-signal line 222 and thegate insulating film 262 and between the second terminal 278 and thegate insulating film 262 in the second transistor 242.

The second insulating film 402 may contain the same material as that ofthe gate insulating film 262 and can be formed by applying the sameformation method as that for the gate insulating film 262. Similar tothe gate insulating film 262, it is also preferred that the secondinsulating film 402 contain silicon oxide in order to suppress carriergeneration in the oxide semiconductor film 264.

In the present embodiment, the first terminal 266 and the secondterminal 268 are formed over the oxide semiconductor film 264, and thenthe second insulating film 402 is formed before forming the image-signalline 222 serving as the first terminal of the second transistor 242 andthe second terminal 278. Next, the insulating film 272, the gateinsulating film 262, and the second insulating film 402 aresimultaneously subjected to etching processing to form opening portionsexposing the semiconductor film 274, and the image-signal line 222 andthe second terminal 278 are formed in the opening portions.

The use of the structure described in the present embodiment enablesprevention of disappearance and contamination of the oxide semiconductorfilm 264 when the opening portions are formed in the insulating film272, the gate insulating film 262, and the second insulating film 402.Furthermore, in the case where an oxide film, which is formed on asurface of the semiconductor film 274 after being exposed, is removedwith a strong acid such as hydrofluoric acid, the oxide semiconductorfilm 264 is prevented from being lost or contaminated.

Similar to the display device 200, the first transistor 240 having theoxide semiconductor film 264 is connected to the display element 250 inthe display device 400. Therefore, display variation between the pixels204 can be reduced, and a display device having high display quality canbe obtained because of small variation in characteristics of atransistor bearing an oxide semiconductor. Furthermore, the capacitor248 and the first transistor 240 are stacked with each other, whichenables the size of the first transistor 240 to be increased byutilizing the large size of the capacitor 248. Hence, the firsttransistor 240 is capable of having a large channel width, by which alarge current can be flowed in the display element 250 and display canbe performed at a high luminance. Accordingly, it is possible tomaintain the potential of the gate electrode 260 of the first transistor240 for a long time, allowing a writing frequency of the image signalVsig from the image-signal line 222 to be significantly reduced andpower consumption to be decreased. Additionally, as described in theFirst and Second Embodiments, the parasitic capacitance between the gateelectrode 260 and the first terminal 266 of the first transistor 240 issmall. Thus, a reduction in luminance and the image-persistingphenomenon caused by the parasitic capacitance can be suppressed.

<Sixth Embodiment>

In the present embodiment, a display device 500 according to anembodiment of the present invention is explained by using FIG. 5 to FIG.7 and FIG. 17. Explanation of the contents duplicated in the First toFifth Embodiments may be omitted.

Similar to the display device 200, the display device 500 also possessesthe plurality of pixels 204 (FIG. 5 and FIG. 6). As shown in FIG. 17,the display device 500 is different in structure of the secondtransistor 242 from the display device 200, and the second transistor242 has the same structure as that of the semiconductor device 100 ofthe First Embodiment. Specifically, a width of the first terminal 502 ofthe second transistor 242 is larger than a width of the second terminal278. Namely, in the second transistor 242, a region in which the firstterminal 502 overlaps with the gate electrode 276 is larger than aregion in which the second terminal 278 overlaps with the gate electrode276. In other words, a region in which the first terminal 502 overlapswith the semiconductor film 274 is larger than a region in which thesecond terminal 278 overlaps with the semiconductor film 274. Hence,when a side of the semiconductor film 274 overlapping with the firstterminal 502 is a first side 504 and a side opposing the first side 504and overlapping with the second terminal 278 is a second side 506, aportion of the first side 504 overlapping with the first terminal 502 islonger than a portion of the second side 506 overlapping with the secondterminal 278. The region in which the first terminal 502 overlaps withthe semiconductor film 274 may be twice to twenty times, three times toten times, or five times to ten times the region in which the secondterminal 278 overlaps with the semiconductor film 274.

In the second transistor 242 having such a structure, a large channelwidth can be maintained, and the parasitic capacitance formed between ateast one terminal (second terminal 278 in an example shown in thepresent embodiment) and the gate electrode 276 can be reduced. Since theparasitic capacitance of the second transistor 242 also influences theluminance and the image-persisting phenomenon of the display element250, the application of this embodiment enables suppression of thesephenomena.

Additionally, the semiconductor film 274 of the second transistor 242can be formed with an oxide semiconductor film. Fabrication of thesemiconductor film 274 of the second transistor 242 with an oxidesemiconductor film allows the potential of the gate electrode 260 of thefirst transistor 240 to be maintained for a long time because of the lowoff-current of a transistor having an oxide semiconductor in a channelregion. Therefore, a writing frequency of the image signal Vsig from theimage-signal line 222 can be drastically reduced, thereby decreasingpower consumption.

<Seventh Embodiment>

In the present embodiment, a display device 600 according to anembodiment of the present invention is explained by using FIG. 5 to FIG.7 and FIG. 18. Explanation of the contents duplicated in the First toSixth Embodiments may be omitted.

Similar to the display device 200, the display device 600 also possessesthe plurality of pixels 204 (FIG. 5 and FIG. 6). As shown in FIG. 18,the display device 600 is different from the display device 200 in thatthe first transistor 240 and the capacitor 248 are not stacked with eachother. Specifically, the oxide semiconductor film 264 of the firsttransistor 240 overlaps with a film including the gate electrode 260 butdoes not overlap with the first electrode 270 of the capacitor 248.Other structures are substantially the same as those of the displaydevice 200, and the first transistor 240 has the same structure as thatof the semiconductor device 100.

The application of such a structure enables a reduction in displayvariation between the pixels 204 and production of a display device withhigh display quality, resulting from the small variation incharacteristics of a transistor having an oxide semiconductor.Additionally, the first transistor 240 maintains a large channel widthand possesses a small parasitic capacitance between the gate electrode260 and the first terminal 266. Hence, it is possible to suppress areduction in luminance and the image-persisting phenomenon caused by theparasitic capacitance.

The aforementioned modes described as the embodiments of the presentinvention can be implemented by appropriately combining with each otheras long as no contradiction is caused. Furthermore, any mode which isrealized by persons ordinarily skilled in the art through theappropriate addition, deletion, or design change of elements or throughthe addition, deletion, or condition change of a process is included inthe scope of the present invention as long as they possess the conceptof the present invention.

In the specification, though the cases of the organic EL display deviceare exemplified, the embodiments can be applied to any kind of displaydevices of the flat panel type such as other self-emission type displaydevices, liquid crystal display devices, and electronic paper typedisplay device having electrophoretic elements and the like, Inaddition, it is apparent that the size of the display device is notlimited, and the embodiment can be applied to display devices having anysize from medium to large.

It is properly understood that another effect different from thatprovided by the modes of the aforementioned embodiments is achieved bythe present invention if the effect is obvious from the description inthe specification or readily conceived by persons ordinarily skilled inthe art.

What is claimed is:
 1. A pixel circuit comprising: a first conductivefilm; a first insulating film over the first conductive film; an oxidesemiconductor film over the first insulating film; a first terminal anda second terminal each electrically connected to the oxide semiconductorfilm; a pixel electrode electrically connected to the second terminal;and a capacitor comprising: a first electrode electrically connected tothe second terminal, the first electrode being located in a layerdifferent from a layer in which any of the first conductive film, thesecond terminal, and the pixel electrode is provided; and a secondinsulating film between the first conductive film and the firstelectrode, wherein a first region where the first terminal overlaps withthe first conductive film is smaller than a second region where thesecond terminal overlaps with the first conductive film, and a thirdregion where the first electrode overlaps with the first conductive filmis larger than the first region and the second region.
 2. The pixelcircuit according to claim 1, wherein the oxide semiconductor film has afirst side and a second side opposing each other, and a portion of thefirst side overlapping with the first terminal is shorter than a portionof the second side overlapping with the second terminal.
 3. The pixelcircuit according to claim 1, wherein the second terminal has an openedshape, and the first terminal is arranged so as to cross an opening ofthe opened shape.
 4. The pixel circuit according to claim 1, configuredso that a current flows from the first terminal to the second terminalvia the oxide semiconductor film.
 5. The pixel circuit according toclaim 1, wherein the first conductive film, the first insulating film,and the oxide semiconductor film form a bottom-gate type firsttransistor, the first conductive film is a gate electrode, and thecapacitor is located between the first transistor and a substrate. 6.The pixel circuit according to claim 5, wherein the gate electrode isshared by the first transistor and the capacitor.
 7. The pixel circuitaccording to claim 5, wherein the first electrode overlaps with theoxide semiconductor film.
 8. The pixel circuit according to claim 5,further comprising a second transistor comprising: a second gateelectrode; a semiconductor film; the second insulating film sandwichedby the second gate electrode and the semiconductor film; and a firstterminal and a second terminal each electrically connected to thesemiconductor film, wherein the second terminal of the second transistoris electrically connected to the gate electrode of the first transistor.9. The pixel circuit according to claim 8, wherein the semiconductorfilm includes silicon.
 10. The pixel circuit according to claim 8,wherein the semiconductor film includes an oxide semiconductor.
 11. Thepixel circuit according to claim 8, wherein, in the second transistor, aregion where the first terminal overlaps with the second gate electrodeis larger than a region where the second terminal overlaps with thesecond gate electrode.
 12. The pixel circuit according to claim 10,wherein the semiconductor film has a first side and a second sideopposing each other, and in the second transistor, a portion of thefirst side overlapping with the first terminal is longer than a portionof the second side overlapping with the second terminal.
 13. The pixelcircuit according to claim 10, wherein, in the second transistor, thefirst terminal has an opened shape, and the second terminal is arrangedso as to cross an opening of the opened shape.
 14. The pixel circuitaccording to claim 1, further comprising a transistor comprising: a gateelectrode existing in the same layer as the first conductive film; agate insulating film under the gate electrode; and a semiconductor filmunder the gate insulating film.
 15. The pixel circuit according to claim14, further comprising a capacitor formed with electrodes formed inlayers which are respectively the same as those of the gate electrodeand the semiconductor film.
 16. The pixel circuit according to claim 15,wherein the semiconductor film and the electrodes are each apolycrystalline semiconductor film.
 17. The pixel circuit according toclaim 1, wherein a region where the second terminal overlaps with theoxide semiconductor film is twice to twenty times a region wherein thefirst terminal overlaps with the oxide semiconductor film.